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IEC 61189-2-808:2024
IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
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Summary
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/25/2024 |
| Edition | 1.0 |
| Page Count | 40 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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