IEC 61189-3:1997+AMD1:1999 Edition 1.1
Superseded Standard
Historical

IEC 61189-3:1997+AMD1:1999 Edition 1.1

IEC 61189-3:1997+AMD1:1999 (Consolidated version) Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Summary

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. THIS CONSOLIDATED VERSION CONSISTS OF THE FIRST EDITION (1997) AND ITS AMENDMENT 1 (1999). THEREFORE, NO NEED TO ORDER AMENDMENT IN ADDITION TO THIS PUBLICATION.

Notes

Combine CEI 61189-3 (1997-04) et AMD 1 (2006-08)

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 11/27/2006
Edition 1.1
Page Count 141
EAN ---
ISBN ---
Weight (in grams) ---
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