IEC 61190-1-1:2002
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IEC 61190-1-1:2002

IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Summary

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 03/25/2002
Edition 1.0
Page Count 41
EAN ---
ISBN ---
Weight (in grams) ---
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