IEC 62148-21:2019
Superseded Standard
Historical

IEC 62148-21:2019

IEC 62148-21:2019 Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Summary

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 03/11/2019
Edition 1.0
Page Count 25
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ISBN ---
Weight (in grams) ---
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