Withdrawn
Standard
Most Recent
IEEE/ISO/IEC 14575:2000
ISO/IEC/IEEE International Standard - Information Technology - Microprocessor systems - Heterogeneous InterConnect (HIC) (Low-Cost, Low-Latency Scalable Serial Interconnect for Parallel System Construction)
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Summary
New IEEE Standard - Inactive-Withdrawn.
Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10–200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.
The scope of this standard is the physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating speeds of 10–200 Mb/s and at 1 Gb/s in copper and optic technologies [as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)].
The purpose of this standard is to enable high performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high level protocols [communications (e.g., ATM), message passing, shared memory transactions, etc.], and to support links between heterogeneous systems.
Enabling the construction of high-performance, scalable, modular, parallel systems with low system integration cost is discussed. Complementary use of physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating at speeds of 10–200 Mb/s and at 1 Gb/s in copper and optic technologies, is described.
The scope of this standard is the physical connectors and cables, electrical properties, and logical protocols for point-to-point serial scalable interconnect, operating speeds of 10–200 Mb/s and at 1 Gb/s in copper and optic technologies [as developed in Open Microprocessor Systems Initiative/Heterogeneous InterConnect Project (OMI/HIC)].
The purpose of this standard is to enable high performance, scalable, modular, parallel systems to be constructed with low system integration cost; to support communications systems fabric; to provide a transparent implementation of a range of high level protocols [communications (e.g., ATM), message passing, shared memory transactions, etc.], and to support links between heterogeneous systems.
Notes
Inactive-Withdrawn
Technical characteristics
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Publication Date | 05/22/2001 |
| Edition | |
| Page Count | 272 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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