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ISO 9453:2020
Soft solder alloys — Chemical compositions and forms
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Summary
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
Notes
60.60 : Norme internationale publiée
Technical characteristics
| Publisher | International Organization for Standardization (ISO) |
| Publication Date | 09/24/2020 |
| Edition | 4 |
| Page Count | 13 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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