Summary
This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
Notes
50.00 : Texte final reçu ou FDIS enregistré pour approbation formelle
Technical characteristics
| Publisher | International Organization for Standardization (ISO) |
| Publication Date | 08/16/2024 |
| Edition | 1 |
| Page Count | 12 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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