Superseded
Standard
Historical
NBN EN ISO 9455-17:2006
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002)
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Summary
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Technical characteristics
| Publisher | Bureau de Normalisation Belge (NBN) |
| Publication Date | 08/04/2006 |
| Cancellation Date | 12/31/2006 |
| Page Count | 33 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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