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NF EN 60191-6-22, C96-013-6-22 (09/2013)
Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
Summary
Le présent document fournit les dessins d'encombrement et les dimensions associées, communs aux structures et matériaux des boîtiers en silicium des boîtiers matriciels à billes (BGA, ball grid array) et des boîtiers matriciels à zone de contact plate (LGA, land grid array).
Technical characteristics
| Publisher | Association Française de Normalisation (AFNOR) |
| Publication Date | 09/01/2013 |
| Release Date | 09/01/2013 |
| Page Count | 21 |
| Themes | Electrotechnologies |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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