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NF EN IEC 63215-2, C93-745-2 (12/2023)
Méthodes d'essai d'endurance pour les matériaux de fixation de puce - Partie 2 : méthode d'essai de cycle thermique pour les matériaux de fixation de puce, appliquée aux dispositifs électroniques de puissance de type discret
Automatic translation from French :
Endurance test methods for chip attach materials - Part 2: Thermal cycle test method for chip attach materials, applied to discrete type power electronic devices
Automatic translation from French :
Endurance test methods for chip attach materials - Part 2: Thermal cycle test method for chip attach materials, applied to discrete type power electronic devices
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Technical characteristics
| Publisher | Association Française de Normalisation (AFNOR) |
| Publication Date | 12/01/2023 |
| Release Date | 12/01/2023 |
| Page Count | 28 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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