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NF EN ISO 9455-17, A81-365-17 (01/2024)
Flux de brasage tendre - Méthodes d'essai - Partie 17 : essai au peigne et essai de migration électrochimique de résistance d'isolement de surface des résidus de flux
Automatic translation from French :
Soft soldering flux - Test methods - Part 17: comb test and electrochemical migration test of surface insulation resistance of flux residue
Automatic translation from French :
Soft soldering flux - Test methods - Part 17: comb test and electrochemical migration test of surface insulation resistance of flux residue
Summary
This document specifies a test method for the possible adverse effects of flux residues after soft soldering or tinning of test coupons. The test is applicable to Type 1 and Type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-incorporated filler wire, preforms or cream. solder made of tin/lead (Sn/Pb) or Sn95.5Ag3Cu0.5 filler metal or other lead-free solder metals as agreed between the user and the supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing or non-lead soldering filler metals. However, soldering temperatures can be agreed between the tester and the customer.
(Automatic translation from French)
(Automatic translation from French)
Technical characteristics
| Publisher | Association Française de Normalisation (AFNOR) |
| Publication Date | 01/01/2024 |
| Release Date | 01/01/2024 |
| Page Count | 34 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |