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PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. An intercomparison evaluation to implement the use of fine-pitch surface insulation resistance (SIR) testing solder fluxes in accordance with IEC 61189-5-501
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Summary
Test methods;Printing board;Structures;Evaluation;Soldering fluxes
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/18/2019 |
| Page Count | 26 |
| Themes | Soldering fluxes |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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