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PD IEC TR 61760-5-1:2024
Surface mounting technology strain on circuit board. Strain gauge measurement applied to chip components
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Summary
Circuits;Integrated circuits;Surface mounting devices;Strain;Printed-circuit boards;Strain gauges;Strain measurement;Microprocessor chips;Components
Notes
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 02/07/2024 |
| Page Count | 28 |
| Themes | Components |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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