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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
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Summary
Components;Substrates (insulating);Structures;Electric connectors;Electronic equipment and components
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/29/2021 |
| Page Count | 18 |
| Themes | Electronic equipment and components |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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