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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic industries
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Summary
Electronic components;Electronic devices;Electrical equipment;Electric machines;Assembly
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 08/23/2022 |
| Page Count | 18 |
| Themes | Assembly |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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