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PD IEC/TS 62647-4:2018
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Ball grid array (BGA) re-balling
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Summary
Electronic components;Grids;Solders;Defence;Management
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 04/25/2018 |
| Page Count | 44 |
| Themes | Management |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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