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SAE SSB 1_002:2014-09-12

Environmental Tests and Associated Failure Mechanisms (Stabilized: Sep 2014)

Summary

This document is an annex to EIA Engineering Bulletin SSB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.
This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

Technical characteristics

Publisher SAE International
Publication Date 09/12/2014
Page Count 13
Themes Aerospace
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