Summary
This document is an annex to EIA Engineering Bulletin SAB-1, Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications (the latest revision).
Technical characteristics
| Publisher | SAE International |
| Publication Date | 09/12/2014 |
| Page Count | 0 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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