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SAE SSB 1D:2020-01-14
Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace, and Other Rugged Applications
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Summary
This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, military, space, extreme, or other environments.
Technical characteristics
| Publisher | SAE International |
| Publication Date | 01/14/2020 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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