VDI/VDE 3719 Blatt 1:2021-03

MID technology enables the integration of mechanical, electrical, electronic, and thermal functions on a spatial circuit carrier. This enables assemblies with a high functional density and a considerable degree of miniaturization. At present, however, there are no generally applicable standards for the manufacture of MIDs that process managers and customers can use as a guideline. This standard provides detailed information on laser direct structuring. It is aimed at users and producers of mechatronically integrated assemblies.