IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
€23.00
IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC 60191-2:1966/AMD6:2002 Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
€186.00
IEC 60191-2:1966/AMD7:2002 Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
IEC 60050-521:2002 International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
€470.00
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€93.00
IEC 60749-31:2002 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
IEC 60749-32:2002 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
IEC 60749-11:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
This product is not for sale, please contact us for more information
IEC 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
€12.00
IEC 60749-8:2002/COR1:2003 Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
€0.00
