IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
€186.00
IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
€302.00
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
€46.00
IEC 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
€244.00
IEC 60191-2:1966/AMD18:2011 Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
€133.00
IEC 62047-10:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
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IEC 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
€93.00
IEC 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
IEC 62047-9:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-5:2011/COR1:2012 Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
€441.00
IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
€12.00
IEC 60191-2:1966/AMD19:2012 Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
