Format for LSI-Package-Board interoperable design
€421.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies method thermal conductivity of circuit high-brightness LEDs. Guidelines
€281.00
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
€201.00
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
€172.00
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
€390.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Reflow soldering ability solder joint, reflow heat resistance
€370.00
Printed electronics Printability. Requirements for reproducibility. Basic patterns evaluation of printing machine
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
Printed electronics Printability. Measurement of qualities. Edge waviness
Printed boards and printed board assemblies. Design use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint land design
Printed electronics Materials. Conductive ink. Measurement of sheet resistance conductive films. Contactless method
Device embedding assembly technology Generic specification for device embedded substrates
Test methods for electrical materials, printed board and other interconnection structures assemblies materials structures. Moisture absorption after pressure vessel conditioning
Printed electronics Materials. Insulator ink. Measurement methods of properties insulator inks and printed insulating layers
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
€24.00
