Space product assurance - Design rules for printed circuit boards
€281.43
Space product assurance - Qualification and Procurement of printed circuit boards
€341.00
Printed boards and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
€106.33
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503 : general test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
€120.00
Materials for printed boards and other interconnecting structures - Part 2-18 : reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
€91.00
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 1 : guide for design and manufacturing of electronic assemblies - Technologies d'assemblage en électronique
€149.33
Electronic assembly technology - Manufacturing line certification for electronic boards (QML) - Part 2 : guide for obtaining QML agreement for electronic boards - Technologies d'assemblage en électronique
€162.33
Materials for printed boards and other interconnecting structures - Part 2-12 : sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 3-3 : collection de spécifications intermédiaires pour les matériaux de base non renforcés, recouverts ou non (prévus pour les circuits imprimés flexibles) - Film flexible de polyester recouvert de colle
Materials for printed boards and other interconnecting structures - Part 3-5 : sectional specification set for unreinforced base materials, clad and unclad (intented for flexible printed boards) - Transfer adhesive films
Materials for printed boards and other interconnecting structures - Part 2-7 : reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
€87.39
Materials for printed boards and other interconnecting structures - Part 2-8 : reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 4-11 : sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
€74.00
Materials for printed boards and other interconnecting structures - Part 2-23 : reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
Materials for printed boards and other interconnecting structures - Part 2-11 : reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
