Draft BS IEC 62271-202/AMD1 ED3 Amendment 1 - High-voltage switchgear and controlgear
€24.00
Draft BS EN 63609-1 Measurement method used in thermal design for electronics assemblies Part 1: requirements the circuit boards or with miniaturized SMDs where heat dissipation path to board is dominant
Draft BS EN 63609-2 Measurement method used in thermal design for electronics assemblies Part 2: conductivity of circuit boards with polymer composites
Technique du montage en surface - Partie 4 : Classification, emballage, étiquetage et manipulation des dispositifs sensibles à l'humidité
€113.50
Technique du montage en surface - Partie 1 : Méthode normalisée pour la spécification des composants pour montage en surface (CMS)
€103.00
Environmental testing Tests. Test XD: Resistance of components and assemblies to liquid cleaning media
€329.00
Draft BS EN IEC 61191-10-2 ED1 Circuit board assemblies Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding
Environmental testing Tests. Test Tf: Solderability of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Draft BS EN 61249-2-55 Materials for printed boards and other interconnecting structures Part 2-55. Reinforced base materials clad unclad. Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) flammability (vertical burning test), copper-clad
Essais d'environnement - Partie 2-83 : Essais - Essai Tf: Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
€134.67
IEC 60068-2-88:2025 Environmental testing - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media
€302.00
IEC 60068-2-83:2025 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Device embedding assembly technology Guideline for stacked electronic module. Test method of intra-module electrical connectivity
€201.00
Techniques d'assemblage avec appareil(s) intégré(s) - Partie 2-603 : lignes directrices pour un empilement de modules électroniques - Méthode d'essai de la connectivité électrique entre modulesAutomatic translation from French : Assembly techniques with integrated device(s) - Part 2-603: guidelines for stacking electronic modules - Method of testing electrical connectivity between modules
€84.00
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 63215-2:2023); German version EN IEC 63215-2:2023
€111.40
