Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction (IEC 91/701/CDV:2007); German version prEN 61188-7:2007
€91.03
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/809/CD:2008)
IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies (IEC 91/151/CD:1998)
€128.22
Amendment to IEC 60749 "Update of Chapter 2 subclause 2.3: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat" and of Chapter 3 clause 5: "Sealing"
€122.34
Mapping rules and exchange methods for heterogeneous parts libraries (IEC 91/1078/CDV:2013); German version FprEN 62699:2013
Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 91/1110/CD:2013)
€98.32
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014.
€105.42
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 91/1231/CD:2014)
€140.00
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
€111.40
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 91/1319/CD:2015)
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009); German version EN 61188-7:2009.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:2010.
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
€84.58
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
€145.14
