31.190 : Electronic component assemblies

IEC 62739-1:2013

IEC 62739-1:2013

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IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

€133.00

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IEC 61190-1-2:2014

IEC 61190-1-2:2014

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IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

€186.00

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IEC 62137-4:2014

IEC 62137-4:2014

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IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

€342.00

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IEC 60068-2-58:2015

IEC 60068-2-58:2015

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IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

€302.00

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IEC TS 62878-2-3:2015

IEC TS 62878-2-3:2015

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IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide

€186.00

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IEC TS 62878-2-4:2015

IEC TS 62878-2-4:2015

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IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

€302.00

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IEC TS 62878-2-1:2015

IEC TS 62878-2-1:2015

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IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology

€244.00

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IEC 60194:2015

IEC 60194:2015

Superseded Historical

IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions

€551.00

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IEC 61760-4:2015

IEC 61760-4:2015

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IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

€302.00

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IEC 62878-1-1:2015

IEC 62878-1-1:2015

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IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods

€389.00

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C90-551 (09/1993)

C90-551 (09/1993)

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Composants électroniques - Généralités - Alliages, flux et crèmes à braser utilisés pour le brasage tendre - Méthodes d'essais

€202.67

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NF C90-540 (03/1986)

NF C90-540 (03/1986)

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Composants électroniques - Généralités - Conducteurs étamés pour composants destinés à être rapportés par brasage tendre.

€91.00

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UTE C90-702 (03/1998)

UTE C90-702 (03/1998)

Superseded Historical

Technique de montage en surface - Spécification générique. Procédures d'agrément de savoir-faire (ASF) pour processus d'assemblage en surface.

€108.50

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NF EN 60352-2/A2, C93-023/A2 (06/2002)

NF EN 60352-2/A2, C93-023/A2 (06/2002)

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Connexions sans soudure - Partie 2 : connexions serties sans soudure - Règles générales, méthodes d'essai et guide pratique

€56.33

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NF EN 62137, C93-704 (06/2005)

NF EN 62137, C93-704 (06/2005)

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Essais d'environnement et d'endurance - Méthodes d'essais pour les cartes à montage en surface de boîtiers de type matriciel FBGA, BGA, FLGA, LGA, SON, et QFN

€106.33

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