Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
€56.17
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-3:2006); German version EN 60917-2-3:2006
€116.64
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006.
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions of subracks and plug-in units (IEC 60297-3-104:2006); German version EN 60297-3-104:2006
€84.58
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
€77.20
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007.
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 60191-6-13:2007); German version EN 60191-6-13:2007.
€91.03
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008); German version EN 60297-3-100:2009.
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (IEC 60297-3-105:2008); German version EN 60297-3-105:2009
€98.32
Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets (IEC 62610-5:2016); German version EN 62610-5:2016
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
€105.42
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016.
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016
€128.22
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)
€342.24
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017.
