Semiconductor devices, mechanical standardization - Tape ball grid array 0,75 mm ball diameter family (IEC 47D/256/CDV:1998)
€69.91
P-FBGA (Plastic Fine pitch Ball Grid Array), 0,5 mm (IEC 47D/315A/CD:1999)
€288.60
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 60679-3:2012); German version EN 60679-3:2013.
€111.40
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013
€98.32
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014.
€105.42
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014.
€229.44
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Guideline of cooling performance evaluation for indoor cabinets (IEC 48D/558/CD:2014)
€84.58
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 48D/585A/CD:2015)
€91.03
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 49/1141/CD:2015)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 61837-4:2015); German version EN 61837-4:2015.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2015); German version EN 61837-3:2015.
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 40/2425/CD:2015)
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 2: Design guide: Method for determination of forced air-cooling structure (IEC 48D/402/CD:2009)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009.
€140.00
