Piezoelectric devices - Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection - General rules (IEC 49/894/CD:2009)
€98.32
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
€105.42
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
€91.03
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
€111.40
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 60917-2-4:2010); German version EN 60917-2-4:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
€84.58
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
Mechanical structures for electronic equipment-Thermal management - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 48D/453/CD:2010)
Mechanical structures for electronic equipment - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Cabinet interface dimensions for miscellaneous equipment (IEC 48D/454/CD:2010)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 4: Combination of performance levels for modular cabinets (IEC 48D/458/CD:2010)
€69.91
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 60368-3:2010); German version EN 60368-3:2010.
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
€116.64
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011); German version EN 61837-2:2011.
€214.30
