Mechanical standardization; outline drawing for semiconductor laser diode devices to be included in IEC publication 60191-2
€34.30
Outlines for semiconductor devices and integrated circuits; outline 5L3 and 5Q3 (IEC: A62B and A62E)
Outlines for semiconductor devices and integrated circuits; outlines 18F3 and 18G3 (IEC: A63D and A63E)
Outlines for semiconductor devices and integrated circuits; outlines 64A2 (IEC A64)
Outlines for semiconductor devices and integrated circuits; outline 65A2 (IEC A65)
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES. PART 2: SECTIONAL SPECIFICATION. INTERFACE CO-ORDINATION DIMENSIONS FOR THE 25 MM EQUIPMENT PRACTICE. SECTION 2: DETAIL SPECIFICATION. DIMENSIONS FOR SUBRACKS, CHASSIS, BACKPLANES, FRONT PANELS AND PLUG-IN UNITS.
€82.00
Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
€69.00
€35.00
Standard Specification for Integrated Circuit Lead Frame Material
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Terminology Relating to Measurements Taken on Thin, Reflecting Films
Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices (Withdrawn 2023)
