31.240 : Mechanical structures for electronic equipment

ASTM F29-97(2009)

ASTM F29-97(2009)

Superseded Historical

Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications

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ASTM F375-89(2010)

ASTM F375-89(2010)

Superseded Historical

Standard Specification for Integrated Circuit Lead Frame Material

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ASTM F375-20

ASTM F375-20

Withdrawn Most Recent

Standard Specification for Integrated Circuit Lead Frame Material (Withdrawn 2023)

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ASTM F18-12(2017)

ASTM F18-12(2017)

Superseded Historical

Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices

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ASTM F29-97(2017)

ASTM F29-97(2017)

Superseded Historical

Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications

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ASTM E2444-11(2018)

ASTM E2444-11(2018)

Active Most Recent

Standard Terminology Relating to Measurements Taken on Thin, Reflecting Films

€58.00

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ASTM E2444-05

ASTM E2444-05

Superseded Historical

Terminology Relating to Measurements Taken on Thin, Reflecting Films

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ASTM F18-64(2006)

ASTM F18-64(2006)

Superseded Historical

Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices

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ASTM E2444-05e1

ASTM E2444-05e1

Superseded Historical

Terminology Relating to Measurements Taken on Thin, Reflecting Films

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ASTM F542-07

ASTM F542-07

Withdrawn Most Recent

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)

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ASTM F542-02

ASTM F542-02

Superseded Historical

Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

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ASTM F29-97(2002) (R1997)

ASTM F29-97(2002) (R1997)

Superseded Historical

Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications

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ASTM F375-89(2005)

ASTM F375-89(2005)

Superseded Historical

Standard Specification for Integrated Circuit Lead Frame Material

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IEC 62610-5:2016

IEC 62610-5:2016

Active Most Recent

IEC 62610-5:2016 Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets

€133.00

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IEC 62739-2:2016

IEC 62739-2:2016

Active Most Recent

IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

€93.00

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