31.240 : Mechanical structures for electronic equipment

IEC 60286-2:2022

IEC 60286-2:2022

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IEC 60286-2:2022 Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes

€302.00

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IEC 61969-1:2023

IEC 61969-1:2023

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IEC 61969-1:2023 Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 1: Design guidelines

€93.00

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IEC 61969-3:2023

IEC 61969-3:2023

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IEC 61969-3:2023 Mechanical structures for electrical and electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects

€133.00

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IEEE 2715:2023

IEEE 2715:2023

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IEEE Guide for the Characterization of the Shielding Effectiveness of Planar Materials

€76.00

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DIN EN 60191-6:2001-07

DIN EN 60191-6:2001-07

Superseded Historical

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/392/CDV:2000); German version prEN 60191-6:2000

€116.64

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DIN EN 60191-2-46:2001-07

DIN EN 60191-2-46:2001-07

Withdrawn Most Recent

Mechanical standardization for semiconductor devices - Small Outline J-Lead package (SOJ) 0,80 mm pitch (IEC 47D/411/CDV); German version prEN 60191-2-46:2001

€41.78

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DIN EN 60191-2-49:2001-07

DIN EN 60191-2-49:2001-07

Withdrawn Most Recent

Mechanical standardization for semiconductor devices - Plastic enhanced, low profile quad flatpack (HLQFP) - Outline family, heat slug up, L-PQFP-G (IEC 47D/410/CDV:2001); German version prEN 60191-2-49:2001

€84.58

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DIN EN 60191-2-50:2001-07

DIN EN 60191-2-50:2001-07

Withdrawn Most Recent

Mechanical standardization for semiconductor devices - Plastic low profile quad flatpack (HLQFP) - Outline family, heat slug down (IEC 47D/407/CDV:2000); German version prEN 60191-2-50:2000

€84.58

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DIN EN 60191-2-51:2001-07

DIN EN 60191-2-51:2001-07

Withdrawn Most Recent

Mechanical standardization of semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug up T-PQFP-G (IEC 47D/418/CDV:2001); German version prEN 60191-2-51:2001

€84.58

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DIN EN 60191-2-52:2001-07

DIN EN 60191-2-52:2001-07

Withdrawn Most Recent

Mechanical standardization for semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug down (IEC 47D/408/CDV:2001); German version prEN 60191-2-52:2001

€84.58

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DIN IEC 60297-3-101:2001-08

DIN IEC 60297-3-101:2001-08

Superseded Historical

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-101: Subracks and associated plug-in units (IEC 48D/255/CD:2000)

€105.42

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DIN EN 60191-6-10:2001-09

DIN EN 60191-6-10:2001-09

Superseded Historical

General rules for the dimensions of P-VSON (IEC 47D/422/CDV:2001); German version prEN 60191-6-10:2001

€69.91

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DIN IEC 60297-3-102:2001-09

DIN IEC 60297-3-102:2001-09

Superseded Historical

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-102: Injector/extractor handle (IEC 48D/256/CD:2000)

€84.58

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DIN IEC 60297-3-103:2001-09

DIN IEC 60297-3-103:2001-09

Superseded Historical

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-103: Keying and alignment pin (IEC 48D/257/CD:2000)

€84.58

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DIN EN 60191-6-12:2001-10

DIN EN 60191-6-12:2001-10

Superseded Historical

General design guideline for rectangular FLGA packages (IEC 47D/395/CDV:2000); German version prEN 60191-6-12:2000

€98.32

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