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19/30396945 DC:2019
BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress
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Summary
Test methods;Printed-circuit boards;Stress;Thermal stress;Reliability;Assessed reliability
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 11/29/2019 |
| Page Count | 17 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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19/12/2023
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19/12/2023
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