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BS EN IEC 63251:2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
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Summary
Test methods;Printed-circuit boards;Stress;Thermal stress;Reliability;Assessed reliability
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 12/19/2023 |
| Page Count | 26 |
| Themes | Assessed reliability |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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19/12/2023
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