NBN EN ISO 9453:2007
Superseded Standard
Historical

NBN EN ISO 9453:2007

Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
Most recent standard

Summary

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
tin-antimony;
tin-bismuth;
tin-copper, with and without silver;
tin-indium, with and without silver and bismuth;
tin-silver, with and without copper and bismuth;
tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.

Technical characteristics

Publisher Bureau de Normalisation Belge (NBN)
Publication Date 12/19/2006
Cancellation Date 04/30/2007
Page Count 0
EAN ---
ISBN ---
Weight (in grams) ---
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