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NBN EN ISO 9453:2020
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
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Summary
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
An indication of the forms generally available is also included.
Technical characteristics
| Publisher | Bureau de Normalisation Belge (NBN) |
| Publication Date | 11/19/2020 |
| Cancellation Date | 04/30/2021 |
| Page Count | 25 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
26/09/2014
Superseded
Historical
Previous versions
19/11/2020
Active
Most Recent
26/09/2014
Superseded
Historical
19/12/2006
Superseded
Historical