29.045 : Semiconducting materials

ASTM F43-99

ASTM F43-99

Withdrawn Most Recent

Standard Test Methods for Resistivity of Semiconductor Materials (Withdrawn 2003)

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ASTM F120-88

ASTM F120-88

Withdrawn Most Recent

Practices for Determination of the Concentration of Impurities in Single Crystal Semiconductor Materials by Infrared Absorption Spectroscopy (Withdrawn 1993)

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ASTM F42-02

ASTM F42-02

Withdrawn Most Recent

Standard Test Methods for Conductivity Type of Extrinsic Semiconducting Materials (Withdrawn 2003)

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ASTM F1894-98(2011)

ASTM F1894-98(2011)

Withdrawn Most Recent

Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness (Withdrawn 2020)

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ASTM F2113-01(2011)

ASTM F2113-01(2011)

Withdrawn Most Recent

Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)

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ASTM F615M-95(2013)

ASTM F615M-95(2013)

Withdrawn Most Recent

Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric) (Withdrawn 2022)

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NF EN 62047-9, C96-050-9 (04/2012)

NF EN 62047-9, C96-050-9 (04/2012)

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS - Dispositifs à semiconducteurs

€109.00

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NF EN 62047-18, C96-050-18 (02/2014)

NF EN 62047-18, C96-050-18 (02/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials - Dispositifs à semiconducteurs

€91.00

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NF EN 62047-11, C96-050-11 (03/2014)

NF EN 62047-11, C96-050-11 (03/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems - Dispositifs à semiconducteurs

€93.33

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NF EN 62047-22, C96-050-22 (12/2014)

NF EN 62047-22, C96-050-22 (12/2014)

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Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates - Dispositifs à semiconducteurs

€93.33

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NF EN 62047-25, C96-050-25 (12/2016)

NF EN 62047-25, C96-050-25 (12/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

€106.33

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NF EN 62047-26, C96-050-26 (06/2016)

NF EN 62047-26, C96-050-26 (06/2016)

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Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures

€123.00

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PD IEC TR 60146-1-2:2019

PD IEC TR 60146-1-2:2019

Active Most Recent

Semiconductor converters. General requirements and line commutated converters Application guide

€421.00

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BS IEC 62899-503-3:2021

BS IEC 62899-503-3:2021

Active Most Recent

Printed electronics Quality assessment. Measuring method of contact resistance for the printed thin film transistor. Transfer length

€201.00

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BS IEC 62899-203:2024

BS IEC 62899-203:2024

Active Most Recent

Printed electronics Materials. Semiconductor ink

€281.00

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