31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
DIN EN 62047-29:2016-08

DIN EN 62047-29:2016-08

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016)

€69.91

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DIN EN 62047-30:2016-08

DIN EN 62047-30:2016-08

Withdrawn Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016)

€105.42

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DIN EN 60749-9:2016-09

DIN EN 60749-9:2016-09

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

€56.17

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DIN EN 60749-6:2016-09

DIN EN 60749-6:2016-09

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 47/2297/CDV:2016); German Version prEN 60749-6:2016

€48.79

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DIN EN 62047-26:2016-12

DIN EN 62047-26:2016-12

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016

€116.64

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DIN EN 62047-1:2016-12

DIN EN 62047-1:2016-12

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016.

€128.22

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DIN IEC 60115-2:2009-11

DIN IEC 60115-2:2009-11

Superseded Historical

Fixed resistors for use in electronic equipment - Part 2: Sectional specification - Fixed low-power non-wirewound resistors (IEC 40/2013/CD:2009)

€140.00

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DIN EN 60749-20:2010-04

DIN EN 60749-20:2010-04

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008); German version EN 60749-20:2009.

€111.40

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DIN EN 62047-6:2010-07

DIN EN 62047-6:2010-07

Active Most Recent

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010

€98.32

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DIN IEC 62047-11:2010-06

DIN IEC 62047-11:2010-06

Superseded Historical

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)

€91.03

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DIN EN 62415:2010-12

DIN EN 62415:2010-12

Active Most Recent

Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010

€77.20

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DIN EN 62416:2010-12

DIN EN 62416:2010-12

Active Most Recent

Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010); German version EN 62416:2010

€77.20

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DIN EN 62418:2010-12

DIN EN 62418:2010-12

Active Most Recent

Semiconductor devices - Metallization stress void test (IEC 62418:2010); German version EN 62418:2010

€98.32

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DIN EN 60747-3:2010-11

DIN EN 60747-3:2010-11

Withdrawn Most Recent

Semiconductor devices - Part 3: Signal (including switching diodes) and regulator diodes (IEC 47E/395/CD:2010)

€157.10

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DIN EN 60749-19:2011-01

DIN EN 60749-19:2011-01

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010.

€56.17

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