Sensor generals and classification for semiconductor sensors (IEC 47E/120/CDV:1998)
€56.17
Semiconductor devices - Discrete devices - Hall elements (IEC 47E/121/CDV:1998)
Amendment to IEC 60747-7: Bipolar transistors (IEC 47E/36A/CDV:1996)
€48.79
Amendment to IEC 60747-8: Field-effect transistors (IEC 47E/37/CDV:1996)
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan (IEC 47/2169/CD:2013)
€128.22
Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013); German version EN 60747-16-5:2013.
€140.00
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
€105.42
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
€91.03
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon-based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 47F/183/CD:2014)
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 47F/178/CD:2013)
€116.64
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting (IEC 47/2189/CD:2014)
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 47F/177/CD:2013)
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting (IEC 47/2190/CD:2014)
€84.58
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 47/2193/CD:2014)
Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method (IEC 47/2191/CD:2014)
