Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling (IEC 47/2027/CDV:2009); German version FprEN 60749-34:2009
€63.27
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 47/2026/CDV:2009); German version FprEN 60749-29:2009
€111.40
Semiconductor devices - Micro-electromechanical devices - Part 12: A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure (IEC 47F/43/CD:2010)
Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials (IEC 47F/48/CD:2010)
€69.91
Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures (IEC 47F/44/CD:2010)
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 47F/59/CD:2010)
€98.32
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (IEC 63287-2:2023); German version EN IEC 63287-2:2023.
Semiconductor devices - Recommendations for data sheets - Voltage reference and voltage regulator diodes
€24.39
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996); German version EN 60749:1999.
€116.64
Amendment 1 to IEC 60747-9: Insulated gate bipolar transistors (IGBTs) (IEC 47E/114/CDV:1998)
€91.03
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000); German version EN 60749:1999 + A1:2000.
€140.00
Semiconductor devices - Part 16-1: Microwave integrated circuits; Amplifiers (IEC 60747-16-1:2001); German version EN 60747-16-1:2002.
€134.02
Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996 + A1:2000 + A2:2001); German version EN 60749:1999 + A1:2000 + A2:2001.
€162.06
