Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA) (IEC 47D/690/CD:2007)
€111.40
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:2007); German version EN 61587-1:2007.
€105.42
Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
€128.22
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 47D/708/CD:2007)
€122.34
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
€84.58
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
€91.03
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/838/CD:2009)
€98.32
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/839/CD:2009)
€116.64
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 49/840/CD:2009)
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/845/CD:2009)
€248.22
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1. (IEC 48D/391/CDV:2009); German version FprEN 60297-3-106:2009
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 48D/392/CDV:2009); German version FprEN 60917-2-4:2009
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions (IEC 48D/398/CD:2009)
€69.91
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements and tests, safety aspects (IEC 48D/399/CD:2009)
