Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines (IEC 48D/397/CD:2009)
€69.91
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)
€105.42
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/906/CD:2010)
€116.64
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
Mechanical structures for electronic equipment - Part 3-107: Dimensions of subracks and plug-in units, micro format (IEC 48D/429/CD:2010)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
€98.32
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)
€41.78
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Sectional specification; coordination dimensions for cases and cabinets (IEC 61969-2:2000); German version EN 61969-2:2000.
€56.17
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-1: Detail specification; dimensions for cabinets (IEC 61969-2-1:2000); German version EN 61969-2-1:2000.
€63.27
Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-2: Detail specification; dimensions for cases (IEC 61969-2-2:2000); German version EN 61969-2-2:2000.
Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Sectional specification; Climatic, mechanical tests and safety aspects for cabinets and cases (IEC 61969-3:2001); German version EN 61969-3:2001.
€77.20
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits; Supplement 1: Extract of the terms
€34.30
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001); German version EN 60191-4:1999 + A1:2002.
€91.03
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis (IEC 61587-1:1999); German version EN 61587-1:1999.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:1999); German version EN 61837-1:1999.
€122.34
