Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP) (IEC 47D/490/CD:2002)
€128.22
IEC 60917-2:1992 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice
€133.00
IEC 60297-3-110:2018 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-110: Residential racks and cabinets for smart houses
IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
€342.00
Dimensions of mechanical structures the 482.6 mm (19 in) series Specification for cabinets and pitches rack
€172.00
Specification for dimensions of panels and racks for electronic equipment
€281.00
Specification for modular plug-in unit and standard 19-inch rack mounting unit based on NIM standard (for electronic nuclear instruments)
Dimensions of mechanical structures the 482.6 mm (19 in) series Specification for subracks and associated plug-in units
€201.00
Specification for dimensions for the mounting of single-hole, bush-mounted spindle operated electronic components
Modular order for the development of mechanical structures for electronic equipment practices
Modular order for the development of mechanical structures electronic equipment practices Guide users IEC Publication 60917
Mechanical structures for electronic equipment. Terminology
Recommendations for shielded enclosures.
€58.00
BS EN IEC 61869-3 Instrument transformers Additional requirements for inductive voltage
€24.00
BS EN IEC 61760-1 Surface mounting technology Part 1: Standard method for the specification of surface components (SMDs)
