31.080 : Semiconductor devices

31.080.01

Semiconductor devices in general

31.080.10

Diodes

31.080.20

Thyristors

31.080.30

Transistors

31.080.99

Other semiconductor devices
DIN EN 60747-16-4:2018-04

DIN EN 60747-16-4:2018-04

Active Most Recent

Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017.

€116.64

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DIN EN IEC 60749-12:2018-07

DIN EN IEC 60749-12:2018-07

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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018.

€56.17

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DIN EN IEC 60749-13:2018-10

DIN EN IEC 60749-13:2018-10

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Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018.

€91.03

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DIN EN 60749-18:2018-10

DIN EN 60749-18:2018-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 47/2468/CDV:2018); German and English version prEN 60749-18:2018

€111.40

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DIN EN IEC 60749-20-1:2018-11

DIN EN IEC 60749-20-1:2018-11

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Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018

€150.65

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DIN EN IEC 60749-30:2019-09

DIN EN IEC 60749-30:2019-09

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2562/CDV:2019); German version prEN IEC 60749-30:2019

€91.03

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DIN EN IEC 60749-20:2019-10

DIN EN IEC 60749-20:2019-10

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/2563/CDV:2019); German and English version prEN IEC 60749-20:2019

€122.34

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DIN EN 60747-16-5/A1:2019-10

DIN EN 60747-16-5/A1:2019-10

Superseded Historical

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 47E/649/CD:2019); Text in German and English

€48.79

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DIN EN IEC 60749-15:2019-12

DIN EN IEC 60749-15:2019-12

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2575/CDV:2019); German and English version prEN IEC 60749-15:2019

€63.27

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DIN EN IEC 60749-18:2020-02

DIN EN IEC 60749-18:2020-02

Active Most Recent

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 60749-18:2019); German version EN IEC 60749-18:2019.

€111.40

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DIN 4000-18:1988-12

DIN 4000-18:1988-12

Active Most Recent

Tabular layouts of article characteristics for semiconductor diodes

€34.30

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DIN 4000-19:1988-12

DIN 4000-19:1988-12

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Tabular layouts of article characteristics for transistors and thyristors

€34.30

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DIN IEC 60747-11:1992-04

DIN IEC 60747-11:1992-04

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Semiconductor devices; sectional specification for semiconductor devices; identical with IEC 60747-11:1985

€63.27

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DIN IEC 60747-3:1992-04

DIN IEC 60747-3:1992-04

Withdrawn Most Recent

Semiconductor devices; discrete devices; part 3: signal diodes and regulator diodes; identical with IEC 60747-3:1985

€111.40

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DIN EN 120003:1996-11

DIN EN 120003:1996-11

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Blank detail specification - Phototransistors, photodarlington transistors, phototransistor arrays; German version EN 120003:1992

€56.17

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