Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:2005)
€116.64
Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
€91.03
Electronic Modules - Generic standard (IEC 91/546/CD:2005)
€77.20
Modular order for the development of mechanical structures for electronic equipment practices (IEC 60917:1988/A1:1993); German version EN 60917:1990/A1:1994
€34.30
Generic specification: Modular electronic units; German version EN 160000:1993/A1:1995
IEC 61188-1-2: Design and use of printed boards and printed board assemblies - Part 1: Generic design and use requirements for printed boards and printed board assemblies; section 2: Controlled impedance (IEC 52/571/CD:1995)
Modular order for the development of mechanical structures for electronic equipment practice (IEC 48D/104/CD:1996)
Amendment 1 to IEC 61189-1: Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 52/643/CD:1996)
€48.79
Amendment 3 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 52/644/CD:1996)
€41.78
Amendment 3 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 52/645/CD:1996)
€69.91
Draft IEC 61191-1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/96/CDV:1996)
€111.40
Draft IEC 61191-2: Sectional specification - Requirements for surface mount solder assembly (IEC 91/97/CDV:1996)
Draft IEC 61191-3: Sectional specification - Requirements for through-hole solder assembly (IEC 91/98/CDV:1996)
Design and use of printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations; section 2: Discrete components (IEC 52/573/CD:1995)
€145.14
Design and use of printed boards and printed boards assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations; section 7: Components with Post (DIP) mounting leads on two sides (IEC 52/578/CD:1995)
€56.17
