Printed board assemblies Generic specification. Requirements for soldered electrical and electronic using surface mount related assembly technologies
€390.00
Printed board assemblies Sectional specification. Requirements for surface mount soldered
€281.00
Specification for components and filter units for radio interference suppression
Components for radio-interferenece suppression devices
Crystalline silicon terrestrial photovoltaic (PV) modules. Design qualification and type approval
€329.00
Harmonized system of quality assessment for electronic components. Generic specification: modular electronic units
€201.00
Harmonized system of quality assessment for electronic components. Blank detail specification. Microwave modular electronic units of assessed quality. Capability approval
€172.00
Harmonized system of quality assessment for electronic components. Sectional specification. Microwave modular units assessed Capability approval procedure
Specification for capability approval of modular electronic networks: generic specification
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
€98.32
IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
€93.00
IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
€389.00
IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
€342.00
