31.190 : Electronic component assemblies

DIN IEC 52/574/CD:1996-12

DIN IEC 52/574/CD:1996-12

Withdrawn Most Recent

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; Section 3: Components with Gull-wing leads on two sides (IEC 52/574/CD:1995)

€98.32

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DIN IEC 52/575/CD:1996-12

DIN IEC 52/575/CD:1996-12

Withdrawn Most Recent

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 4: Components with J leads on two sides (IEC 52/575/CD:1995)

€63.27

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DIN IEC 52/576/CD:1996-12

DIN IEC 52/576/CD:1996-12

Withdrawn Most Recent

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 5: Components with Gull-wing leads on four sides (IEC 52/576/CD:1995)

€105.42

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DIN IEC 52/577/CD:1996-12

DIN IEC 52/577/CD:1996-12

Superseded Historical

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 6: Components with J leads on four sides (IEC 52/577/CD:1995)

€84.58

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DIN IEC 52/686/CDV:1997-05

DIN IEC 52/686/CDV:1997-05

Withdrawn Most Recent

IEC 61188-2: Design and use of printed boards and printed board assemblies - Part 2: Guide to the use of printed wiring board substrate materials; surface mount technology (IEC 52/686/CDV:1996)

€56.17

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DIN EN 60917:1991-05

DIN EN 60917:1991-05

Superseded Historical

Modular order for the development of mechanical structures for electronic equipment practices (IEC 60917:1988); german version EN 60917:1990

€63.27

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DIN EN 60917-0:1993-02

DIN EN 60917-0:1993-02

Superseded Historical

Modular order for the development of mechanical structures for electronic equipment practices; part 0: guide for the users of IEC 917 (IEC 60917-0:1989); german version EN 60917-0:1992

€77.20

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DIN IEC 91(Sec)28:1993-09

DIN IEC 91(Sec)28:1993-09

Withdrawn Most Recent

Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies; identical with IEC 91(Secretariat)28:1993

€179.53

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DIN IEC 52(Sec)435:1993-11

DIN IEC 52(Sec)435:1993-11

Superseded Historical

IEC 61188-1-1: design for printed boards and printed board assemblies; part 1: engineering consideration; section 1: flatness of electronic assemblies (IEC 52(Secretariat)435:1993)

€56.17

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DIN EN 160000:1994-03

DIN EN 160000:1994-03

Withdrawn Most Recent

Generic specification: modular electronic units; German version EN 160000:1993

€56.17

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DIN IEC 3A(Sec)341:1994-06

DIN IEC 3A(Sec)341:1994-06

Superseded Historical

Technical Report; application of IEC 60617-12 and 60617-13; identical with IEC 3A(Secretariat)341:1993

€56.17

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BS EN 61189-2:1997

BS EN 61189-2:1997

Superseded Historical

Test methods for electrical materials, printed boards and other interconnection structures assemblies materials

€421.00

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BS EN 61192-2:2003

BS EN 61192-2:2003

Withdrawn Most Recent

Workmanship requirements for soldered electronic assemblies Surface-mount

€390.00

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BS EN 61192-1:2003

BS EN 61192-1:2003

Withdrawn Most Recent

Workmanship requirements for soldered electronic assemblies General

€421.00

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BS EN 61340-3-1:2002

BS EN 61340-3-1:2002

Superseded Historical

Electrostatics. Methods for simulation of electrostatic effects Human body model (HBM). Component testing

€172.00

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