Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness
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Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices
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IEC 60146-1-1:2024 Semiconductor converters - General requirements and line commutated converters - Part 1-1: Specification of basic requirements
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Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth
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Testing of materials for semiconductor technology - Determination of etch rates of etching mixtures - Part 3: Aluminium; gravimetric method
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Testing of materials for semiconductor technology - Determination of dislocations in monocrystals of III-V-compound semi-conductors - Part 1: Gallium arsenide
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Testing of materials for semiconductor technology - Determination of traces of metals in liquids - Part 1: Silver (Ag), Gold (Au), copper (Cu), iron (Fe), potassium (K) and sodium (Na) in nitric acid by AAS
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Testing of materials for semiconductor technology - Determination of trace elements in liquids - Part 2: Calcium (Ca), Cobolt (Co), chromium (Cr), copper (Cu), iron (Fe), nickel (Ni) and zinc (Zn) in hydrofluoric acid with plasma-induced emission spectroscopy
Testing of materials for semiconductor technology - Determination of traces of elements in liquids - Part 3: Aluminium (Al), cobalt (Co), copper (Cu), sodium (Na), nickel (Ni), and zinc (Zn) in nitric acid with ICP-MS
Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
Mask engineering; introduction, terms and definitions
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Mask engineering; substrates
Mask engineering; pattern
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Mask engineering; pellicles