Semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor (IEC 47E/353/CD:2007)
€98.32
Constant Current Electromigration Test (IEC 47/1954/CD:2008)
€84.58
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 47/1961/CD:2008)
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS FBAR Filter & Duplexer (IEC 47/1969/CD:2008)
€111.40
Electrostatic Discharge Sensitivity Testing - Transmission Line Pulse (TLP) - Component Level (IEC 47/2006/CDV:2008)
€105.42
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 47/2012/CD:2009)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2014/CDV:2009); German version FprEN 60749-15:2009
€63.27
Semiconductor devices - Part 1: General (IEC 47/2015A/CDV:2009)
€56.17
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) (IEC 47/2018/CDV:2009); German version EN 60749-32:2003/FprA1:2009
€41.78
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/2017/CDV:2009); German version EN 60749-23:2004/FprA1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 47/2016/CDV:2009); German version EN 60749-19:2003/FprA1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/2019/CDV:2009); German version EN 60749-30:2005/FprA1:2009
€48.79
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (IEC 47/2021/CDV:2009); German version FprEN 60749-7:2009
€69.91
Semiconductor die products - Part 2: Exchange data formats (IEC 47/2023/CDV:2009); English version FprEN 62258-2:2009
€185.05
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/2025/CDV:2009); German version FprEN 60749-21:2009
